INT | Research Group Kübel

Zeiss Auriga 60

Zeiss Auriga 60
Zeiss Auriga 60

Configuration

  • Operation Voltage:

    • High Tension SEM: 200 V - 30 kV

    • High Tension FIB: 0.2 kV - 30 kV      

  • Source

    • FEG (Schottky)

    • Gallium Liquid Metal Ion Source

  • Imageing Detectors:

    • In-lens SE, SESI,  EsB, 4QBSD

    • STEM detector

  • Spectroscopy

    • EDAX EDX detector

  • Diffraction

    • EDAX EBSD detector

  • Gas Injection System (GIS)

    • C, Pt, and Si

    • XeF2 for selective etch enhancing

    • Gas injection for charge compensation

  • Manipulators

    • Omniprobe 400 with independent x,y, z motion and rotation

  • Transfer System

    • High-vacuum transfer system compatible with glove box and UHV deposition system

 

Resolution

  30 kV 15 kV 1 kV
Electron Beam [nm] 1.0 1.0 1.9
Gallium Ion Beam  [nm] 2.5    

 

Imaging, Analysis and Sample Preparation Techniques      

  • SE & BSE SEM analysis

  • STEM imaging

  • EDX analysis

  • EBSD analysis

  • 3D Slice & View tomography

  • TEM sample preparation

  • Nanoscale deposition and contacting